Materials

Ceramics (alumina, AlN, LTCC), Ferrites, Films

Printed Circuit Boards

2-18 layers, HDI, buried, blind µvias, embedded passives, automotive

Flex Circuits 

Multilayers, HDI

Precision Stamping

In-house tooling & plating, electronic materials

Injection & Insert (Over) Molding

In-house mold flow analysis, clean room, 30-180 Ton

Assembly

Wafer and component (clean room), board and system level

Optics

Custom lenses, IR, image sensors, microbolometers, scopes, custom and standard cameras

LED's

Specializing in UV “C” packaging and assemblies (custom components for sterilization)